Epoxy board: glass fiber cloth bonded with epoxy resin heated pressure produced in the high temperature mechanical properties, electrical properties and stability at high humidity. For mechanical, electrical and electronic components with high insulation structure, has good high mechanical and dielectric properties of heat resistance and moisture resistance. Heat class F (155 degrees). Specifications Thickness: 0.5 ~ 100mm in the case of high temperature 180 ℃ thermal deformation, generally not with other metals in a heat may cause deformation of sheet metal applications 1 forms. Various resins, curing agents, modifiers system can be adapted to the requirements of almost all kinds of applications made to the form, which can range from very low viscosity to high melting solids. 2, curing and convenient. Use a variety of different curing agents, epoxy resin systems can be cured at a temperature almost 0 ~ 180 ℃ range. 3, strong adhesion. Epoxy inherent molecular chain polar hydroxyl group and an ether bond exist [1] in to a variety of substances with high adhesion. Epoxy curing low shrinkage, internal stress generated, which also helps to improve the adhesion strength. 4, low shrinkage. The reaction of the epoxy resin and the curing agent is used by direct addition reaction epoxy resin molecule or ring-opening polymerization reaction carried out, without water or other volatile byproducts released. They are unsaturated polyester resins, phenolic resins compared to exhibit very low shrinkage (less than 2%) during the curing process. 5, the mechanical properties. The cured epoxy resin system with excellent mechanical properties.